Module Catalogues

IC Technology and Engineering

Module Title IC Technology and Engineering
Module Level Level 3
Module Credits 5.00

Aims and Fit of Module

To equip students with solid theoretical knowledge as well as practical experience in integrated circuit technology and engineering, including the overview of integrated circuit manufacturing/fabrication from wafer processing, technology node, CAD automation, fabrication procedure and equipment, cleanliness, yield to wafer test and packaging.

Learning outcomes

A	Apply the concepts of wafer processing, technology node, fabrication procedure and equipment
B	Apply theoretical and practical knowledge in CAD automation and its software-oriented design platform
C	Apply the knowledge of cleanliness, yield, wafer test and packaging to advanced IC technology development
D	Classify and determine the problem solving standard procedures from IC technology and CAD platform perspectives
E	Develop independent design skills for cross-over application ranging from IC fabrication technology to circuit design automation

Method of teaching and learning

This module is delivered through a combination of formal lectures, tutorials, design exercises and supervised laboratory sessions.