Aims and Fit of Module
To equip students with solid theoretical knowledge as well as practical experience in integrated circuit technology and engineering, including the overview of integrated circuit manufacturing/fabrication from wafer processing, technology node, CAD automation, fabrication procedure and equipment, cleanliness, yield to wafer test and packaging.
A Apply the concepts of wafer processing, technology node, fabrication procedure and equipment
B Apply theoretical and practical knowledge in CAD automation and its software-oriented design platform
C Apply the knowledge of cleanliness, yield, wafer test and packaging to advanced IC technology development
D Classify and determine the problem solving standard procedures from IC technology and CAD platform perspectives
E Develop independent design skills for cross-over application ranging from IC fabrication technology to circuit design automation
Method of teaching and learning
This module is delivered through a combination of formal lectures, tutorials, design exercises and supervised laboratory sessions.